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Co-design-LSI Chip, Package and Mother Board

We provide the low-cost and high quality design solution based on our total design service of LSI chip, package and mother board.

DDR Interfacing Technique (Co-design)

DDR interfaces are used in various equipment in order to achieve fast data transfer with a low cost package and mother board.

DDR Interface

As the data transfer rates of DDR interfaces approach 1Gbps/pin, achieving system operation with the mother board design technologies alone, is problematic. To solve this problem we have established a "co-design" methodology to achieve total design optimization among LSI packages and the mother board.

Design,Total Optimization is Important Co-design,Operation Failure,Stable Operation
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Feature of Our Co-design Solution (Timing Optimization)

Even if the 667Mbps design is used for the 1Gbps system design, it is difficult to achieve stable operation. With our proposed LSI/PKG solution coupled with our simulated transmission line technology and expertise a stable system can be realized.

Operation Margin Decreases in 1Gbps or more

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Necessary for Total Timing Budget Optimization for Transmission Line (IO/PKG/Substrate), and LSI

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Possible to Propose LSI/PKG Countermeasure against "Over 1Gbps Problem"

Waveform Comparison between 667Mpbs and 1Gpbs,Timing Breakdown
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Feature of Our Co-design Solution
(PKG Ball Assignment Optimization)

The package plays a significant role in transmitting electrical signals between the LSI device and the mother board. Consequently the placement of PKG BGA balls is a key element in controlling cost/performance of the entire system. We offer the best ball assignment for our clients' products based on our know-how and highly accurate simulation technology.

LSI Design,PKG Design,Mother Board Design
Optimum design of mother board (Layers/Parts reduction) and chip (Area minimization)
are achieved by optimized PKG ball assignment proposal
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Our Co-design Flow

In contrast to the traditional design flow, we developed a new design flow containing the LSI-PKG mother board co-design. This is done at the initial design stage and to establish design parameters in the sequence of mother board > package > LSI.

This new design flow, which optimizes the entire flow and minimizes return procedures, results in low cost, high quality product development.

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